Articles from Intel

Today at Computex 2025, Intel unveils a new lineup of graphics processing units (GPUs) and AI accelerators designed for professionals and developers. Intel’s announcements include:

Intel Corp. (INTC) and Amazon Web Services. Inc. (AWS), an Amazon.com company (NASDAQ: AMZN), today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel. This is a significant expansion of the two companies’ longstanding strategic collaboration to help customers power virtually any workload and accelerate the performance of artificial intelligence (AI) applications.

What's New: Intel today launched its most efficient family of x86 processors ever, the Intel® Core™ Ultra 200V series processors. They deliver exceptional performance, breakthrough x86 power efficiency, a massive leap in graphics performance, no-compromise application compatibility, enhanced security and unmatched AI compute. The technology will power the industry’s most complete and capable AI PCs with more than 80 consumer designs from more than 20 of the world’s top manufacturing partners, including Acer, ASUS, Dell Technologies, HP, Lenovo, LG, MSI and Samsung. Pre-orders begin today with systems available globally on-shelf and online at over 30 global retailers starting Sept. 24. All designs featuring Intel Core Ultra 200V series processors and running the latest version of Windows are eligible to receive Copilot+ PC features as a free update starting in November.

Intel Corporation recently learned of an unsolicited “mini-tender offer” made by Tutanota LLC (Tutanota) to Intel stockholders to purchase up to 1 million shares of Intel common stock at $34 per share. The offer price of $34 per share is conditioned on, among other things, the closing price per share of Intel’s common stock exceeding $34 per share on the last trading day before the offer expires. Unless this condition is waived by Tutanota, Intel stockholders who tender their shares in the offer will receive a below-market price. Tutanota can extend the offer for successive periods of 45 to 180 days, in which case payment would be delayed beyond the scheduled expiration date of Wednesday, Sept. 4, 2024.

Intel Corporation today announced that it will report second-quarter 2024 financial results on Thursday, Aug. 1, 2024, promptly after close of market. Intel will then hold an earnings conference call at 2 p.m. PDT that day to discuss the results.

Today, Nature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits. The industry-leading research opens the door for the mass production and continued scaling of silicon-based quantum processors, all of which are requirements for building a fault-tolerant quantum computer.

What’s New: Today, Intel announced it surpassed 500 AI models running optimized on new Intel® Core™ Ultra processors – the industry’s premier AI PC processor available in the market today, featuring new AI experiences, immersive graphics and optimal battery life. This significant milestone is a result of Intel’s investment in client AI, the AI PC transformation, framework optimizations and AI tools including OpenVINO™ toolkit. The 500 models, which can be deployed across the central processing unit (CPU), graphics processing unit (GPU) and neural processing unit (NPU), are available across popular industry sources, including OpenVINO Model Zoo, Hugging Face, ONNX Model Zoo and PyTorch. The models draw from categories of local AI inferencing, including large language, diffusion, super resolution, object detection, image classification/segmentation, computer vision and others.

What’s New: Today, Intel announced that it has built the world's largest neuromorphic system. Code-named Hala Point, this large-scale neuromorphic system, initially deployed at Sandia National Laboratories, utilizes Intel’s Loihi 2 processor, aims at supporting research for future brain-inspired artificial intelligence (AI), and tackles challenges related to the efficiency and sustainability of today’s AI. Hala Point advances Intel’s first-generation large-scale research system, Pohoiki Springs, with architectural improvements to achieve over 10 times more neuron capacity and up to 12 times higher performance.

Today, Intel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage. As the Official Worldwide AI Platform Partner of the Olympic and Paralympic Games Paris 2024, Intel will introduce new, innovative AI experiences based on Intel hardware and software that enable next-generation engagement for fans, organizers, athletes and viewers around the world.

The following is an opinion editorial from Lama Nachman, Intel Fellow and director of the Intelligent Systems Research Lab at Intel Labs.

Intel (Nasdaq: INTC):

What’s New: To answer network operators’ demands for energy-efficient scaling, Intel Corporation disclosed two major updates to drive footprint, power and total cost of ownership (TCO) savings across 5G core networks: the preview of its Intel® Xeon® next-gen processors, code-named Sierra Forest, with up to 288 Efficient-cores (E-cores), and the commercial availability of the Intel® Infrastructure Power Manager (IPM) software for 5G core.

Intel (Nasdaq: INTC):

What’s New: Today, Intel released the results of its 2023 Product Security Report. Intel’s industry-leading and transparent product security assurance practices improve product defenses. Proactive investments accounted for 94% of its vulnerability disclosures in 2023, the highest in five years.

What’s New: Today, Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Intel’s breakthrough 3D packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance and cost.

On Feb. 21, Intel will launch its annual flagship foundry event, IFS Direct Connect, in San Jose, California. Intel Chief Executive Officer Pat Gelsinger and other Intel leaders, including Stuart Pann, senior vice president and general manager of Intel Foundry Services, will deliver keynotes and news that bring to life Intel’s vision for delivering the world’s first AI system foundry and define the next era of silicon design, development and manufacturing.

Today at CES, Intel announced plans to drive the company’s AI everywhere strategy into the automotive market, including a deal to acquire Silicon Mobility, a fabless silicon and software company that specializes in SoCs for intelligent electric vehicle (EV) energy management. Intel also announced: a new family of AI-enhanced software-defined vehicle system-on-chips (SoCs), with Zeekr as the first original equipment manufacturer (OEM) to adopt the new SoC to deliver its generative AI-driven living room experiences to next-generation vehicles.

Please replace the release issued Jan. 08, 2024 with the following corrected version due to revisions to the first bullet under "The new processor family includes:" and footnote 2.

Intel Corp. (Nasdaq: INTC) and DigitalBridge Group, Inc. (NYSE: DBRG; “DigitalBridge”), a global investment firm, today announced the formation of Articul8 AI, Inc. (Articul8), an independent company offering enterprise customers a full-stack, vertically-optimized and secure generative artificial intelligence (GenAI) software platform. The platform delivers AI capabilities that keep customer data, training and inference within the enterprise security perimeter. The platform also provides customers the choice of cloud, on-prem or hybrid deployment.

At its “AI Everywhere” launch in New York City today, Intel introduced an unmatched portfolio of AI products to enable customers’ AI solutions everywhere — across the data center, cloud, network, edge and PC.

The rapid onset of artificial intelligence enables new possibilities for innovation and collaboration – whether at work or at play. It is driving a fundamental shift in computing that promotes interconnectivity between technology and humanity.

Intel Labs is showcasing some of its most significant and industry-first AI innovations at NeurIPS 2023 — the leading global event for developers, researchers, and academic professionals focused on AI and computer-vision technologies. The event takes place Dec. 10-16 in New Orleans.

cnvrg.io, an Intel company and provider of artificial intelligence (AI) and large language model (LLM) platforms, today released the results of its 2023 ML Insider survey. While every industry appears to be racing toward AI, the annual survey revealed that despite interest, a majority of organizations are not yet leveraging generative AI (GenAI) technology.

Intel® Granulate™, Intel’s flagship software performance offering, today announced a new collaboration with Databricks to merge Intel Granulate’s autonomous, continuous optimization solutions with Databricks’ robust Data Intelligence Platform under the Databricks Partner Program. Designed to help customers derive greater scalability, this collaboration intends to enhance performance, reduce costs and increase efficiency across data management operations.

Join Intel Chief Executive Officer Pat Gelsinger and other Intel leaders for Intel's “AI Everywhere” event. Marking a momentous year for the company, Intel will accelerate its execution engine and power AI workloads across the data center, the cloud and the edge with the launch of 5th Gen Intel® Xeon® processors and Intel® Core™ Ultra processors.

Join Intel leaders as they announce the start of high-volume manufacturing on the Intel 4 process technology at Fab 34 in Leixlip, Ireland. Intel CEO Pat Gelsinger, Dr. Ann Kelleher, general manager of Technology Development at Intel, and Keyvan Esfarjani, chief global operations officer, will explain how the delivery of this manufacturing step, made possible by extreme ultraviolet (EUV) technology, will usher in a future of leading-edge Intel products – from processors delivering artificial intelligence to PCs to chips powering the world’s biggest data centers.

The following is an opinion editorial by Gabriela Cruz Thompson, senior director of University Research and Collaboration at Intel Labs.

During the second day of Intel Innovation 2023, Intel Chief Technology Officer Greg Lavender offered a detailed look at how Intel's developer-first, open ecosystem philosophy is working to ensure the opportunities of artificial intelligence (AI) are accessible to all.

At its third annual Intel Innovation event, Intel unveiled an array of technologies to bring artificial intelligence everywhere and make it more accessible across all workloads, from client and edge to network and cloud.

What’s New: Intel today announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore’s Law to deliver data-centric applications.

​What’s New: Today, Intel announced the global grand-prize winners at its third-annual AI Global Impact Festival. The festival brings together future developers, and educators who are working to solve real-world problems using artificial intelligence (AI), with the support of policymakers and academic leaders. Students from 26 countries participated in the competition at this year’s festival, “Enriching Lives with AI Innovation.” Intel’s event program focused on building digital readiness for all students and celebrating AI innovations that drive inclusion, accessibility and responsible impact.

Join Intel Chief Executive Officer Pat Gelsinger, Chief Technology Officer Greg Lavender and other Intel leaders at Intel® Innovation 2023, a premier event for global developer communities. In an age fueled by artificial intelligence, developers will engage with their peers and learn from the brightest minds in the industry to use breakthroughs in hardware, software, services and advanced technologies to speed development, drive innovation and help hone every competitive edge.

​On Aug. 21-22, Intel will host a live virtual event for researchers, data scientists and developers focused on building artificial intelligence (AI) applications from edge to cloud. The two-day event – oneAPI DevSummit for AI 2023 – is designed for attendees to:

​What’s New: As part of a collaboration with Intel and Dell Technologies, the United Kingdom Atomic Energy Authority (UKAEA) and the Cambridge Open Zettascale Lab plan to build a “digital twin” of the Spherical Tokamak for Energy Production (STEP) prototype fusion power plant. The UKAEA will utilize the lab’s supercomputer based on Intel technologies, including 4th Gen Intel® Xeon® Scalable processors, distributed asynchronous object storage (DAOS) and oneAPI tools to streamline the development and delivery of fusion energy to the grid in the 2040s.

Intel (Nasdaq: INTC):

Intel (Nasdaq: INTC):

Intel and the Gordon and Betty Moore Foundation today hosted a tribute to celebrate the life of Gordon Moore, Intel’s co-founder.

What’s New: Today, Intel announced a new Intel® Connectivity Analytics program that helps wireless solution providers generate unique networking and system insights – from network health and security to quality of service and customer experience – to deliver enhanced applications and services to their customers. The program is available to vendors worldwide and is already being integrated with new program participants Wyebot and Ambeent.

Intel today published its Product Security Report for 2022, underscoring the company’s long-standing commitment to product security assurance. The fourth-annual report demonstrates that Intel’s proactive investments were responsible for finding and mitigating 93% of all vulnerabilities addressed over the past four years.

What’s New: Today, Intel announced the 2023 release of the Intel® oneAPI tools – available in the Intel® Developer Cloud and rolling out through regular distribution channels. The new oneAPI 2023 tools support the upcoming 4th Gen Intel® Xeon® Scalable processors, Intel® Xeon® CPU Max Series and Intel® Data Center GPUs, including Flex Series and the new Max Series. The tools deliver performance and productivity enhancements, and also add support for new Codeplay1 plug-ins that make it easier than ever for developers to write SYCL code for non-Intel GPU architectures. These standards-based tools deliver choice in hardware and ease in developing high-performance applications that run on multiarchitecture systems.

What’s New: Intel Foundry Services (IFS) today launched a strategic addition to its design ecosystem Accelerator program. The new USMAG (United States Military, Aerospace and Government) Alliance brings together a trusted design ecosystem with U.S.-based manufacturing to enable assured chip design and production on advanced process technologies and meet the stringent design and production requirements of national security applications. A first in the industry, the program’s initial members include leading companies like Cadence, Synopsys, Siemens EDA, Intrinsix and Trusted Semiconductor Solutions.

The Intel Labs and Components Research organizations have demonstrated the industry’s highest reported yield and uniformity to date of silicon spin qubit devices developed at Intel’s transistor research and development facility, Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. This achievement represents a major milestone for scaling and working towards fabricating quantum chips on Intel’s transistor manufacturing processes.

On Day 2 of Intel Innovation, Intel illustrated how its efforts and investments to foster an open ecosystem catalyze community innovation, from silicon to systems to apps and across all levels of the software stack.

What’s New: Today, Intel announced the winners of its second annual Intel Hardware Security Academic Award program, aimed at fostering innovative research into solutions, tools and methodologies to address fundamental security challenges and enhance the industry’s ability to deliver more secure and trustworthy foundational technologies.

Join Chief Executive Officer Pat Gelsinger, Chief Technology Officer Greg Lavender and other Intel leaders at Intel® Innovation, a technology showcase dedicated to spotlighting the tools, training and community created to empower the world’s developers to create what’s next.

What’s new: Mobileye, an Intel company, has launched the EyeQ Kit™ – its first software development kit (SDK) for the EyeQ® system-on-chip that powers driver-assistance and future autonomous technologies for automakers worldwide. Built to leverage the powerful and highly power-efficient architecture of the upcoming EyeQ®6 High and EyeQ®Ultra processors, EyeQ Kit allows automakers to utilize Mobileye's proven core technology, while deploying their own differentiated code and human-machine interface tools on the EyeQ platform.

On July 12, 2022, Intel will host a live virtual event – oneAPI DevSummit for AI 2022 – focused on building AI applications that seamlessly scale from edge to cloud.

What’s New: Intel Labs announces a significant advancement in its integrated photonics research – the next frontier in increasing communication bandwidth between compute silicon in data centers and across networks. The latest research features industry-leading advancements in multiwavelength integrated optics, including the demonstration of an eight-wavelength distributed feedback (DFB) laser array that is fully integrated on a silicon wafer and delivers excellent output power uniformity of +/- 0.25 decibel (dB) and wavelength spacing uniformity of ±6.5% that exceed industry specifications.

At RSA Conference this week in San Francisco, Intel reinforced its commitment to security. At the event, leaders from Intel and its ecosystem partners came together to discuss how the company is addressing some of the toughest security challenges, including hybrid workforces and an increase in connected devices. Intel’s approach remains steadfast, investing in unparalleled people, processes and products to deliver security without sacrificing performance.

​Join Intel experts for panel discussions and talks at this year’s RSA Conference 2022 and BSides SF 2022, taking place in San Francisco and virtually starting June 4.

What’s New: In the latest release of TensorFlow 2.9, the performance improvements delivered by the Intel® oneAPI Deep Neural Network Library (oneDNN) are turned on by default. This applies to all Linux x86 packages and for CPUs with neural-network-focused hardware features (like AVX512_VNNI, AVX512_BF16, and AMX vector and matrix extensions that maximize AI performance through efficient compute resource usage, improved cache utilization and efficient numeric formatting) found on 2nd Gen Intel® Xeon® Scalable processors and newer CPUs. These optimizations enabled by oneDNN accelerate key performance-intensive operations such as convolution, matrix multiplication and batch normalization, with up to 3 times performance improvements compared to versions without oneDNN acceleration.

What’s New: Intel has released an open source tool to migrate code to SYCL1 through a project called SYCLomatic, which helps developers more easily port CUDA code to SYCL and C++ to accelerate cross-architecture programming for heterogeneous architectures. This open source project enables community collaboration to advance adoption of the SYCL standard, a key step in freeing developers from a single-vendor proprietary ecosystem.

What’s New: Today at Intel Vision 2022, Intel announced seven new mobile processers to the 12th Gen Intel® Core™ mobile family. The 12th Gen Intel® Core™ HX processors utilize desktop-caliber silicon in a mobile package – to deliver high levels of performance for professional workflows like CAD, animation and visual effects. The HX processors are unlocked out of the box and available in Core i5, Core i7 and Core i9 models.

The following is an opinion editorial by Rick Echevarria, vice president and general manager of the Intel RISE Technology Initiative at Intel Corporation.

Intel today announced the first phase of its plans to invest as much as 80 billion euros in the European Union over the next decade along the entire semiconductor value chain – from research and development (R&D) to manufacturing to state-of-the art packaging technologies. Today’s announcement includes plans to invest an initial 17 billion euros into a leading-edge semiconductor fab mega-site in Germany, to create a new R&D and design hub in France, and to invest in R&D, manufacturing and foundry services in Ireland, Italy, Poland and Spain. With this landmark investment, Intel plans to bring its most advanced technology to Europe, creating a next-generation European chip ecosystem and addressing the need for a more balanced and resilient supply chain.

Subhead of release should read: Swiss Re explores further protection of critical data using confidential computing, powered by Intel SGX technology and enabled by Decentriq

What’s New: Swiss Re, a leading global reinsurance provider, is working with Decentriq’s confidential computing-based platform powered by Intel® Software Guard Extensions (Intel® SGX) to help secure data privacy while performing analytics on sensitive datasets. This collaboration allows Swiss Re to apply Intel SGX technology to its cloud services to provide new levels of protection to data in use, harnessing the industry’s most tested and most widely deployed hardware-based data center-trusted execution environment.

During a keynote at IAA Mobility today, Intel CEO Pat Gelsinger and Sixt SE Co-CEO Alexander Sixt announced a collaboration to begin offering autonomous ride-hailing services in Munich in 2022. The collaboration between Intel subsidiary Mobileye and SIXT, a leading international provider of mobility services headquartered in Germany, also aspires to scale driverless ride-sharing services across Germany and other European countries later this decade.

What’s New: The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel’s dedicated foundry business launched this year, will lead the work.

Intel (Nasdaq: INTC): What’s New: Intel is announcing a major expansion of its Intel® AI for Workforce Program to help educate the next generation of U.S. technologists, engineers and inventors — and to help them land careers in their chosen fields, ranging from healthcare to nursing to business. To support the expansion of the program across the U.S., Intel is collaborating with Dell Technologies to provide technical and infrastructure expertise. Students who complete the program, which is being added at 18 schools across 11 U.S. states, will receive a certificate or an associate degree in artificial intelligence (AI).

What’s New: Today, Intel and QuTech – a collaboration between Delft University of Technology and the Netherlands Organisation for Applied Scientific Research – published key findings in quantum research to address the “interconnect bottleneck” that exists between quantum chips that sit in cryogenic dilution refrigerators and the complex room-temperature electronics that control the qubits. The innovations were covered in Nature, the industry-leading science journal of peer-reviewed research, and mark an important milestone in addressing one of the biggest challenges to quantum scalability with Intel’s cryogenic controller chip Horse Ridge.

What’s New: Starting today, Microsoft Defender for Endpoint expands its use of Intel® Threat Detection Technology (Intel® TDT) beyond accelerated memory scanning capabilities to activate central processing unit (CPU) based cryptomining machine learning (ML) detection. This move further accelerates endpoint detection and response for millions of customers without compromising experience.

Mobileye, an Intel Company, and Udelv, a Silicon Valley venture-backed company, announced that Mobileye’s self-driving system ― branded Mobileye Drive™ ― will “drive” the next-generation Udelv autonomous delivery vehicles (ADV), called “Transporters.” The companies plan to produce more than 35,000 Mobileye-driven Transporters by 2028, with commercial operations beginning in 2023. Today’s news is believed to be the first large-scale deal for a self-driving system and signals that Mobileye Drive is ready for commercial deployment in solutions involving the autonomous movement of goods and people.